With the rapid development of the whole electronic industry, new fields such as smart phones, Internet of things, Internet vehicles, medical care, wearable devices and so on are constantly being developed, and new products emerge in an endless stream, which also has a huge impact on the PCB industry.
In general, according to the number of layers and development direction of PCB, the PCB industry is divided into six major sub products: single panel, double-sided board, conventional multilayer board, flexible board, HDI (high-density interconnection) board and packaging substrate. From the four cycle dimensions of product life cycle such as "introduction period growth period mature period recession period", single panel and double-sided panel are in recession period because they are not suitable for the short and light application trend of electronic products. The proportion of output value is gradually decreasing. Developed countries and regions such as Japan, South Korea and Taiwan have rarely produced such products in their own country, and many large factories have already finished manufacturing Make it clear that it is no longer connected to single and double-sided boards. Conventional multilayer board and HDI are mature products with increasingly mature process capability and high added value, which are the main supply direction of most major PCB manufacturers. Only a few Chinese manufacturers, such as ultrasonic electronics, have mastered the production technology; Flexible board, especially high-density flexible board and rigid rigid composite board, is a growing product due to its immature technology and failure to realize mass production by a large number of manufacturers. However, because it is more suitable for digital products than rigid board, flexible board has a high growth, which is the future development direction of each large manufacturer. The packaging substrate used in IC, whether in R & D or manufacturing, is relatively mature in developed countries such as Japan and South Korea, but it is still in the stage of technology exploration in China. It can be predicted that the packaging substrate will have a huge market in the future.
Specific to each market, first look at the field of mobile devices. The mobile device industry is one of the most challenging and innovative fields. Smart phones and tablets are the main growth drivers in this field. Today, smart phones have accounted for one third of the whole mobile phone market, and there is a continuous growth trend. The tablet computer market also shows a strong growth momentum. Analysts predict that there will be a leap in tablet sales. At the same time, in the game console or static digital camera, we also see the increasing demand for HDI PCB products. In the aspect of PCB interconnection density, the PCB product is required to be smaller in shape, which further increases the complexity. This field is mainly driven by the development of the chip field, and the size of the chip is becoming smaller and smaller, which has an impact on the PCB. Because the PCB must connect the chip with other components, the main challenge is to keep the electromechanical characteristics while making the conductive structure smaller and the PCB thinner.
In the automotive field, improving efficiency while ensuring top quality standards is the main problem of the industry. The development trend of high-tech components increases the demand for high-density interconnect micro blind hole boards and arbitrary step boards. It may be seen that the applications related to the electric transportation electrification and electric steering lightweight design of the transmission system - hybrid components and electric components are growing beyond the average level, and the most stringent reliability and PCB quality standards are required in the safety aspects of applications such as ADAS, brake assist, side and rear view cameras, car-to-x communication platform, etc. In the automotive field, the demand for PCB presents four trends
Environment: automobile manufacturers urgently need to reduce the fuel and energy consumption of vehicles, new electronic components need to reduce carbon dioxide emissions and install energy recovery system, the use of heat recovery power generation needs heat system, therefore, to use heat-resistant thick copper PCB products. This trend will increase the demand for robust structure PCB products.
Safety and information: in the developed automotive market, the number of entertainment, information and navigation applications is expected to further increase. A variety of electronic components are integrated into the cab, and each component needs to be equipped with a unique PCB product. With the increasing number of consumer based functions, the demand for more sophisticated circuit boards, such as GPS, Bluetooth and DVD, has been boosted. Although the change is quite slow, high-density interconnect micro blind hole board and laminated substrate are all high-tech PCB products. High current and heat reduction technology is regarded as the exclusive technology in the information field.
Cost: low cost vehicles are in great demand in emerging countries. Low price, high quality and high safety performance require solutions based on thin PCB products. The copper content of such PCB products is lower than that of high-end entertainment systems. This relatively simple PCB technology will coexist with high-density interconnection technology, as the share of low-cost vehicles is expected to continue to increase in the next few years - even in industrial countries.
In the industrial and medical fields, different customers have different technical requirements, which is a major feature of the industrial electronics industry. In the field of medical care, reducing the volume and weight is the most important, especially in devices such as pacemaker.
